Method for preparing semiconductor device with copper-manganese liner

ABSTRACT

The present disclosure provides a method for preparing a semiconductor device with a copper-manganese liner. The method includes forming an opening structure in a first dielectric layer, wherein the opening structure has a first portion, a second portion and a third portion disposed between and physically connecting the first portion and the second portion; forming a lining material lining the first portion and the second portion of the opening structure and completely filling the third portion of the opening structure, wherein the lining material includes copper-manganese (CuMn); filling the first portion and the second portion of the opening structure with a conductive material after the lining material is formed; and performing a planarization process on the lining material and the conductive material.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. Non-Provisionalapplication Ser. No. 17/240,287 filed 26 Apr. 2021, which isincorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a method for preparing a semiconductordevice, and more particularly, to a method for preparing a semiconductordevice with a copper-manganese liner.

DISCUSSION OF THE BACKGROUND

Semiconductor devices are essential for many modern applications. Withthe advancement of electronic technology, semiconductor devices arebecoming smaller in size while providing greater functionality andincluding greater amounts of integrated circuitry. Due to theminiaturized scale of semiconductor devices, various types anddimensions of semiconductor devices providing different functionalitiesare integrated and packaged into a single module. Furthermore, numerousmanufacturing operations are implemented for integration of varioustypes of semiconductor devices.

However, the manufacturing and integration of semiconductor devicesinvolve many complicated steps and operations. Integration insemiconductor devices becomes increasingly complicated. An increase incomplexity of manufacturing and integration of the semiconductor devicemay cause deficiencies, such as void formed in conductive structure,which results from the difficulties in filling a high aspect ratioopening. Accordingly, there is a continuous need to improve themanufacturing process of semiconductor devices so that the problems canbe addressed.

This Discussion of the Background section is provided for backgroundinformation only. The statements in this Discussion of the Backgroundare not an admission that the subject matter disclosed in this sectionconstitutes prior art to the present disclosure, and no part of thisDiscussion of the Background section may be used as an admission thatany part of this application, including this Discussion of theBackground section, constitutes prior art to the present disclosure.

SUMMARY

In one embodiment of the present disclosure, a semiconductor device isprovided. The semiconductor device includes a first electrode and asecond electrode disposed in a first dielectric layer. The semiconductordevice also includes a first liner separating the first electrode fromthe first dielectric layer. The semiconductor device further includes afuse link disposed in the first dielectric layer. The fuse link isdisposed between and electrically connected to the first electrode andthe second electrode, and the fuse link and the first liner are made ofcopper-manganese (CuMn).

In an embodiment, the first electrode and the second electrode are madeof copper (Cu). In an embodiment, the semiconductor device furtherincludes a second liner separating the second electrode from the firstdielectric layer, wherein the second liner is made of CuMn. In anembodiment, the first liner, the second liner and the fuse link areconnected to form a continuous structure. In an embodiment, a topsurface of the first liner is coplanar with a top surface of the firstelectrode.

In an embodiment, the semiconductor device further includes a seconddielectric layer disposed over the first dielectric layer, and aplurality of conductive contacts disposed in the second dielectriclayer, wherein a first set of the plurality of conductive contacts iselectrically connected to the first electrode, and a second set of theplurality of conductive contacts is electrically connected to the secondelectrode. In an embodiment, the semiconductor device further includes apatterned mask disposed between the first dielectric layer and thesecond dielectric layer, wherein a top surface of the fuse link iscoplanar with a top surface of the patterned mask.

In another embodiment of the present disclosure, a semiconductor deviceis provided. The semiconductor device includes a first well region and asecond well region disposed in a semiconductor substrate. Thesemiconductor device also includes a first dielectric layer disposedover the semiconductor substrate and covering the first well region andthe second well region, and a gate structure disposed over the firstdielectric layer and between the first well region and the second wellregion. The semiconductor device further includes a conductive structuredisposed over and separated from the first well region by a portion ofthe first dielectric layer. The conductive feature includes a barrierlayer and a conductive plug disposed over the barrier layer, and thebarrier layer is made of copper-manganese (CuMn). The first well region,the conductive structure and the portion of the first dielectric layerform an anti-fuse structure.

In an embodiment, the conductive plug of the conductive structure ismade of copper (Cu). In an embodiment, the barrier layer covers a bottomsurface and sidewalls of the conductive plug. In an embodiment, thesemiconductor device further includes a gate conductive plug disposedover the gate structure, wherein the conductive plug of the conductivestructure and the gate conductive plug are made of different materials.

In an embodiment, the semiconductor device further includes a seconddielectric layer disposed over the first dielectric layer, wherein thegate structure, the conductive structure and the gate conductive plugare disposed in the second dielectric layer, and wherein the firstdielectric layer and the second dielectric layer are made of differentmaterials. In an embodiment, the semiconductor device further includes adeep well region disposed in the semiconductor substrate, wherein thefirst well region and the second well region are disposed in the deepwell region. In an embodiment, the first well region and the second wellregion have a first conductivity type, and the deep well region has asecond conductivity type opposite to the first conductivity type.

In yet another embodiment of the present disclosure, a method forpreparing a semiconductor device is provided. The method includesforming an opening structure in a first dielectric layer. The openingstructure has a first portion, a second portion and a third portiondisposed between and physically connecting the first portion and thesecond portion. The method also includes forming a lining materiallining the first portion and the second portion of the opening structureand completely filling the third portion of the opening structure. Thelining material is made of copper-manganese (CuMn). The method furtherincludes filling the first portion and the second portion of the openingstructure with a conductive material after the lining material isformed, and performing a planarization process on the lining materialand the conductive material.

In an embodiment, the first portion of the opening structure has a firstwidth, the second portion of the opening structure has a second width,the third portion of the opening structure has a third width, the firstwidth, the second width and the third width are parallel to each other,and wherein the first width and the second width are both greater thanthe third width. In an embodiment, forming the opening structure in thefirst dielectric layer includes using a patterned mask as an etchingmask, and wherein the planarization process is performed until thepatterned mask is exposed. In an embodiment, the conductive material ismade of copper (Cu).

In an embodiment, after the planarization process is performed, aremaining portion of the lining material in the third portion of theopening structure is configured as a fuse link, a remaining portion ofthe conductive material in the first portion of the opening structure isconfigured as a first electrode, and a remaining portion of theconductive material in the second portion of the opening structure isconfigured as a second electrode, and wherein the first electrode, thesecond electrode and the fuse link form a fuse structure. In anembodiment, the method further includes forming a second dielectriclayer over the fuse structure, and forming a plurality of conductivecontacts penetrating through the second dielectric layer, wherein afirst set of the plurality of conductive contacts is electricallyconnected to the first electrode, and a second set of the plurality ofconductive contacts is electrically connected to the second electrode.

Embodiments of a semiconductor device and method for preparing the sameare provided in the disclosure. In some embodiments, the semiconductordevice includes a conductive structure (e.g., an electrode or aconductive plug) disposed in a dielectric layer, and a copper-manganese(CuMn) liner or barrier layer separating the conductive structure fromthe dielectric layer. In some embodiment, the conductive structure ismade of copper (Cu), and the CuMn liner or barrier layer is configuredto reduce or prevent voids from forming in the conductive structure,thereby reducing the contact resistance and improving theelectromigration reliability of the conductive structure. As a result,the device performance may be improved.

The foregoing has outlined rather broadly the features and technicaladvantages of the present disclosure in order that the detaileddescription of the disclosure that follows may be better understood.Additional features and advantages of the disclosure will be describedhereinafter, and form the subject of the claims of the disclosure. Itshould be appreciated by those skilled in the art that the conceptionand specific embodiment disclosed may be readily utilized as a basis formodifying or designing other structures or processes for carrying outthe same purposes of the present disclosure. It should also be realizedby those skilled in the art that such equivalent constructions do notdepart from the spirit and scope of the disclosure as set forth in theappended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a top view illustrating a semiconductor device, in accordancewith some embodiments.

FIG. 2 is a cross-sectional view illustrating the semiconductor devicealong the sectional line A-A′ of FIG. 1 , in accordance with someembodiments.

FIG. 3 is a cross-sectional view illustrating the semiconductor devicealong the sectional line B-B′ of FIG. 1 , in accordance with someembodiments.

FIG. 4 is a cross-sectional view illustrating a semiconductor device, inaccordance with some other embodiments.

FIG. 5 is a flow diagram illustrating a method for preparing asemiconductor device, in accordance with some embodiments.

FIG. 6 is a flow diagram illustrating a method for preparing asemiconductor device, in accordance with some other embodiments.

FIG. 7 is a top view illustrating an intermediate stage of forming anopening structure in a first dielectric layer during the formation ofthe semiconductor device, in accordance with some embodiments.

FIG. 8 is a cross-sectional view illustrating an intermediate stage inthe formation of the semiconductor device along the sectional line A-A′of FIG. 7 , in accordance with some embodiments.

FIG. 9 is a cross-sectional view illustrating an intermediate stage inthe formation of the semiconductor device along the sectional line B-B′of FIG. 7 , in accordance with some embodiments.

FIG. 10 is a cross-sectional view illustrating an intermediate stage offorming a lining material in the opening structure during the formationof the semiconductor device taken along the same sectional line as FIG.8 , in accordance with some embodiments.

FIG. 11 is a cross-sectional view illustrating an intermediate stage offorming a lining material in the opening structure during the formationof the semiconductor device taken along the same sectional line as FIG.9 , in accordance with some embodiments.

FIG. 12 is a cross-sectional view illustrating an intermediate stage offilling the opening structure with a conductive material during theformation of the semiconductor device taken along the same sectionalline as FIG. 10 , in accordance with some embodiments.

FIG. 13 is a cross-sectional view illustrating an intermediate stage offilling the opening structure with a conductive material during theformation of the semiconductor device taken along the same sectionalline as FIG. 11 , in accordance with some embodiments.

FIG. 14 is a top view illustrating an intermediate stage of performing aplanarization process during the formation of the semiconductor device,in accordance with some embodiments.

FIG. 15 is a cross-sectional view illustrating an intermediate stage inthe formation of the semiconductor device along the sectional line A-A′of FIG. 14 , in accordance with some embodiments.

FIG. 16 is a cross-sectional view illustrating an intermediate stage inthe formation of the semiconductor device along the sectional line B-B′of FIG. 14 , in accordance with some embodiments.

FIG. 17 is a cross-sectional view illustrating an intermediate stage offorming a first dielectric layer over a semiconductor substrate duringthe formation of the semiconductor device, in accordance with some otherembodiments.

FIG. 18 is a cross-sectional view illustrating an intermediate stage offorming a gate structure over the first dielectric layer and formingwell regions in the semiconductor substrate during the formation of thesemiconductor device, in accordance with some other embodiments.

FIG. 19 is a cross-sectional view illustrating an intermediate stage offorming a second dielectric layer over the first dielectric layer andforming an opening in the second dielectric layer during the formationof the semiconductor device, in accordance with some other embodiments.

FIG. 20 is a cross-sectional view illustrating an intermediate stage ofsequentially forming a barrier material and a conductive material in theopening during the formation of the semiconductor device, in accordancewith some other embodiments.

FIG. 21 is a cross-sectional view illustrating an intermediate stage ofplanarizing the barrier material and the conductive material during theformation of the semiconductor device, in accordance with some otherembodiments.

FIG. 22 is a cross-sectional view illustrating an intermediate stage offorming a gate conductive plug over the gate structure during theformation of the semiconductor device, in accordance with some otherembodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

FIG. 1 is a top view illustrating a semiconductor device 100, and FIGS.2 and 3 are cross-sectional views illustrating the semiconductor device100 along the sectional lines A-A′ and B-B′ of FIG. 1 , respectively, inaccordance with some embodiments. In some embodiments, the semiconductordevice 100 is a fuse structure. As shown in FIGS. 1 to 3 , thesemiconductor device 100 includes a first dielectric layer 103, apatterned mask 105 disposed over the first dielectric layer 103, and asecond dielectric layer 141 disposed over the patterned mask 105. Notethat the second dielectric layer 141 shown in FIGS. 2 and 3 are notshown in the top view of FIG. 1 , in order to simplify the drawing.

Moreover, the semiconductor device 100 includes a first electrode 135 a,a second electrode 135 b, a first liner 125 a, a second liner 125 b anda fuse link 125 c disposed in the first dielectric layer 103.Specifically, the lower portions of the first electrode 135 a, thesecond electrode 135 b, the first liner 125 a, the second liner 125 band the fuse link 125 c are embedded in the first dielectric layer 103,and the upper portions of the first electrode 135 a, the secondelectrode 135 b, the first liner 125 a, the second liner 125 b and thefuse link 125 c are embedded in the patterned mask 105, in accordancewith some embodiments.

In some embodiments, the first electrode 135 a is separated from thesecond electrode 135 b, and the fuse link 125 c is disposed between andelectrically connected to the first electrode 135 a and the secondelectrode 135 b. In some embodiments, the first electrode 135 a issurrounded by the first liner 125 a, and the second electrode 135 b issurrounded by the second liner 125 b. Specifically, the sidewalls andthe bottom surface of the first electrode 135 a are covered by the firstliner 125 a, and the sidewalls and the bottom surface of the secondelectrode 135 b is covered by the second liner 125 b. In other words,the first electrode 135 a is separated from the first dielectric layer103 and the patterned mask 105 by the first liner 125 a, and the secondelectrode 135 b is separated from the first dielectric layer 103 and thepatterned mask 105 by the second liner 125 b.

It should be noted that the first liner 125 a, the second liner 125 band the fuse link 125 c are physically connected to form a continuousstructure with no interface therebetween. The dashed lines indicatingthe boundaries of the first liner 125 a, the second liner 125 b and thefuse link 125 c in FIG. 1 are used to clarify the disclosure. No obviousinterfaces exist between the first liner 125 a, the second liner 125 band the fuse link 125 c. In some embodiments, the first liner 125 a, thesecond liner 125 b and the fuse link 125 c are formed in the sameprocess and are formed of the same material. In some embodiments, thefirst liner 125 a, the second liner 125 b and the fuse link 125 cinclude copper-manganese (CuMn), and the first electrode and the secondelectrode include copper (Cu), for example.

Still referring to FIGS. 1 to 3 , the semiconductor device 100 furtherincludes a plurality of conductive contacts 143 disposed in the seconddielectric layer 141. In some embodiments, a first set of the conductivecontacts 143 is disposed over and electrically connected to the firstelectrode 135 a, and a second set of the conductive contacts 143 isdisposed over and electrically connected to the second electrode 135 b.Although only three conductive contacts 143 are shown over each of thefirst electrode 135 a and the second electrode 135 b in FIG. 1 , anynumber of conductive contacts 143 may be provided over the firstelectrode 135 a and the second electrode 135 b.

FIG. 4 is a cross-sectional view illustrating a semiconductor device200, in accordance with some other embodiments. In some embodiments, thesemiconductor device 200 includes an anti-fuse structure 300, which willbe described in detail later.

As shown in FIG. 4 , the semiconductor device 200 includes asemiconductor substrate 201, a plurality of isolation structures 203disposed in the semiconductor substrate 201, a deep well region 205disposed in the semiconductor substrate 201 and between the isolationstructures 203, and a first well region 217 and a second well region 219disposed in the deep well region 205. In some embodiments, the firstwell region 217 and the second well region 219 have a first conductivitytype, and the deep well region 205 has a second conductivity typeopposite to the first conductivity type. For example, the deep wellregion 205 is lightly doped with a p-type dopant, and the first wellregion 217 and the second well region 219 are heavily doped with ann-type dopant.

Moreover, in some embodiments, the semiconductor device 200 includes afirst dielectric layer 207 disposed over the semiconductor substrate 201and covering the first well region 217 and the second well region 219, agate structure 213 and a conductive structure 257 disposed over thefirst dielectric layer 207, and a gate conductive plug 283 disposed overthe gate structure 213. In some embodiments, the gate structure 213 isdisposed between the first well region 217 and the second well region219, and the conductive structure 257 is disposed over the first wellregion 217. It should be noted that the conductive structure 257 isseparating from the first well region 217 by a portion of the firstdielectric layer 207.

In some embodiments, the gate structure 213 includes a gate dielectriclayer 209 and a gate electrode layer 211 disposed over the gatedielectric layer 209. In some embodiments, gate spacers 215 are disposedon opposite sidewalls of the gate structure 213. In addition, theconductive structure 257 includes a barrier layer 245 and a conductiveplug 255 disposed over the barrier layer 245. In some embodiments, thebarrier layer 245 covers a bottom surface and sidewalls of theconductive plug 255. In some embodiments, the barrier layer 245 is madeof CuMn, and the conductive plug 255 is made of Cu, for example.

Still referring to FIG. 4 , the semiconductor device 200 furtherincludes a second dielectric layer 221 disposed over the firstdielectric layer 207, a third dielectric layer 291 disposed over thesecond dielectric layer 221, and conductive layers 293 and 295 disposedin the third dielectric layer 291. In some embodiments, the gatestructure 213, the conductive structure 257 and the gate conductive plug283 are disposed in the second dielectric layer 221. In someembodiments, the conductive layer 293 is disposed over and electricallyconnected to the conductive structure 257, and the conductive layer 295is disposed over and electrically connected to the gate structure 213through the gate conductive plug 283.

In some embodiments, the first dielectric layer 207 has a portion 207′sandwiched between the conductive structure 257 and the first wellregion 217. It should be noted that the first well region 217, theconductive structure 257 and the portion 207′ of the first dielectriclayer 207 collectively form the anti-fuse structure 300. The conductivestructure 257 may be referred to as top electrode of the anti-fusestructure 300, and the first well region 217 may be referred to asbottom electrode of the anti-fuse structure 300.

FIG. 5 is a flow diagram illustrating a method 10 for forming asemiconductor device (e.g., the semiconductor device 100), and themethod 10 includes steps S11, S13, S15, S17, S19 and S21, in accordancewith some embodiments. FIG. 6 is a flow diagram illustrating a method 30for forming a semiconductor device (e.g., the semiconductor device 200),and the method 30 includes steps S31, S33, S35, S37, S39, S41 and S43,in accordance with some other embodiments. The steps S11 to S21 of FIG.5 and the steps S31 to S43 of FIG. 6 are elaborated in connection withthe following figures.

FIG. 7 is a top view illustrating an intermediate stage of forming anopening structure 120 in a first dielectric layer 103 during theformation of the semiconductor device 100, FIG. 8 is a cross-sectionalview taken along the sectional line A-A′ of FIG. 7 , and FIG. 9 is across-sectional view taken along the sectional line B-B′ of FIG. 7 , inaccordance with some embodiments. As shown in FIGS. 7 to 9 , a firstdielectric layer 103 is provided, and a patterned mask 105 with anopening structure 110 is formed over the first dielectric layer 103.

In some embodiments, the first dielectric layer 103 is made of siliconoxide, silicon nitride, silicon oxynitride, a combination thereof, oranother dielectric material. The first dielectric layer 103 may beformed above a semiconductor substrate (not shown), such as part of aninterlayer dielectric (ILD) or intermetal dielectric (IMD) layer in asemiconductor chip. In addition, the opening structure 110 in thepatterned mask 105 includes a first portion 110 a, a second portion 110b and a third portion 110 c disposed between and connected to the firstportion 110 a and the second portion 110 b.

An etching process is performed on the first dielectric layer 103 usingthe patterned mask 105 as an etching mask, such that an openingstructure 120 is formed in the first dielectric layer 103, as shown inFIGS. 7 to 9 in accordance with some embodiments. The respective step isillustrated as the step S11 in the method 10 shown in FIG. 5 . In someembodiments, the etching process includes a wet etching process, a dryetching process, or a combination thereof, and the opening structure 110is transferred from the patterned mask 105 to the first dielectric layer103, such that the opening structure 120 is formed.

In some embodiments, the opening structure 120 does not penetratethrough the first dielectric layer 103. Similar to the pattern of theopening structure 110 in the patterned mask 105, the opening structure120 includes a first portion 120 a, a second portion 120 b and a thirdportion 120 c disposed between and connected to the first portion 120 aand the second portion 120 b. In some embodiments, the first portion 110a of the opening structure 110 and the first portion 120 a of theopening structure 120 have a width W1 (see FIG. 8 ), the third portion110 c of the opening structure 110 and the third portion 120 c of theopening structure 120 have a width W2 (see FIG. 9 ), and the width W1 isgreater than the width W2.

Since the profiles of the second portion 110 b of the opening structure110 and the second portion 120 b of the opening structure 120 aresimilar to the profiles of the first portion 110 a of the openingstructure 110 and the first portion 120 a of the opening structure 120,the cross-sectional view taken along the second portions 110 b and 120 bare not illustrated. In some embodiments, the second portion 110 b ofthe opening structure 110 and the second portion 120 b of the openingstructure 120 have a width (not shown) that is substantially the same asthe width W1 in FIG. 8 . Therefore, the width of the second portions 110b and 120 b is also greater than the width W2 of the third portions 110c and 120 c. It should be noted that the widths W1, W2 and W3 areparallel to each other.

FIGS. 10 and 11 are cross-sectional views illustrating an intermediatestage of forming a lining material 123 in the opening structures 110 and120 during the formation of the semiconductor device 100, where FIG. 10is taken along the same sectional line as FIG. 8 (i.e., the sectionalline A-A′), and FIG. 11 is taken along the same sectional line as FIG. 9(i.e., the sectional line B-B′), in accordance with some embodiments. Asshown in FIGS. 10 and 11 , the lining material 123 is conformallydeposited in the opening structures 110 and 120, and over the topsurface of the patterned mask 105. The respective step is illustrated asthe step S13 in the method 10 shown in FIG. 5 .

The first portions 110 a, 120 a and the second portions 110 b, 120 b ofthe opening structures 110 and 120 have widths that are greater thanthat of the third portions 110 c, 120 c of the opening structures 110and 120. Therefore, the third portions 110 c, 120 c are completelyfilled by the lining material 123, while the first portions 110 a, 120 aand the second portions 110 b, 120 b are partially filled by the liningmaterial 123. In particular, the sidewalls of the first portion 110 aand the second portion 110 b, and the bottom surfaces and the sidewallsof the first portion 120 a and the second portion 120 b are lined by thelining material 123. In some embodiments, the lining material 123 ismade of CuMn, and is formed by a deposition process, such as a chemicalvapor deposition (CVD) process, an atomic layer deposition (ALD)process, a physical vapor deposition (PVD) process, or a combinationthereof.

FIGS. 12 and 13 are cross-sectional views illustrating an intermediatestage of filling the opening structures 110 and 120 with a conductivematerial 133 during the formation of the semiconductor device 100, whereFIG. 12 is taken along the same sectional line as FIG. 10 (i.e., thesectional line A-A′), and FIG. 13 is taken along the same sectional lineas FIG. 11 (i.e., the sectional line B-B′), in accordance with someembodiments.

As shown in FIGS. 12 and 13 , the conductive material 133 is formed inthe opening structures 110 and 120, and over the top surface of thepatterned mask 105. The respective step is illustrated as the step S15in the method 10 shown in FIG. 5 . In some embodiments, the conductivematerial 133 is made of Cu, and is formed by a deposition process, suchas a CVD process, an ALD process, a PVD process, a sputtering process, aplating process, or a combination thereof. It should be noted that theremaining first portions 110 a, 120 a and the remaining second portions110 b, 120 b of the opening structures 110, 120 are completely filled bythe conductive material 133, in accordance with some embodiments.

FIG. 14 is a top view illustrating an intermediate stage of performing aplanarization process during the formation of the semiconductor device100, FIG. 15 is a cross-sectional view taken along the sectional lineA-A′ of FIG. 14 , and FIG. 16 is a cross-sectional view taken along thesectional line B-B′ of FIG. 14 , in accordance with some embodiments. Asshown in FIGS. 14 to 16 , a planarization process is performed on thelining material 123 and the conductive material 133 until the topsurface of the patterned mask 105 is exposed. The respective step isillustrated as the step S17 in the method 10 shown in FIG. 5 .

The planarization process may include a chemical mechanical polishing(CMP) process. In some embodiments, the planarization process removesexcess portions of the lining material 123 and the conductive materials133 outside the opening structure 110 in the patterned mask 105 and theopening structure 120 in the first dielectric layer 103. As a result, aremaining portion of the lining material 123 in the first portions 110 aand 120 a of the opening structures 110 and 120 is configured as thefirst liner 125 a, a remaining portion of the lining material 123 in thesecond portions 110 b and 120 b of the opening structures 110 and 120 isconfigured as the second liner 125 b, and a remaining portion of thelining material 123 in the third portions 110 c and 120 c of the openingstructures 110 and 120 is configured as the fuse link 125 c.

Moreover, after the planarization process is performed, a remainingportion of the conductive material 133 in the first portions 110 a and120 a of the opening structures 110 and 120 is configured as the firstelectrode 135 a, and a remaining portion of the conductive material 133in the second portions 110 b and 120 b of the opening structures 110 and120 is configured as the second electrode 135 b. As shown in FIGS. 15and 16 , the patterned mask 105 has a top surface T1, the firstelectrode 135 a has a top surface T2, the first liner 125 a has a topsurface T3, and the fuse link 125 c has a top surface T4. In someembodiments, the top surfaces T1, T2, T3 and T4 are substantiallycoplanar with each other. Within the context of this disclosure, theword “substantially” means preferably at least 90%, more preferably 95%,even more preferably 98%, and most preferably 99%.

Referring back to FIGS. 1 to 3 , after the planarization process, thesecond dielectric layer 141 is formed over the patterned mask 105, inaccordance with some embodiments. The respective step is illustrated asthe step S19 in the method 10 shown in FIG. 5 . The second dielectriclayer 141 may include silicon oxide, silicon nitride, siliconoxynitride, a combination thereof, or another dielectric material, andmay be formed by a deposition process, such as a CVD process, an ALDprocess, a PVD process, a spin-on coating process, or a combinationthereof.

After the second dielectric layer 141 is formed, the conductive contacts143 are formed penetrating through the second dielectric layer 141 tocontact the first electrode 135 a and the second electrode 135 b, asshown in FIGS. 1 to 3 in accordance with some embodiments. Therespective step is illustrated as the step S21 in the method 10 shown inFIG. 5 . In some embodiments, the conductive contacts 143 are made of aconductive material, such as tungsten (W), aluminum (Al), titanium (Ti),tantalum (Ta), gold (Au), silver (Ag), copper (Cu), or a combinationthereof.

In some embodiments, the formation of the conductive contacts 143includes forming a plurality of openings (not shown) in the seconddielectric layer 141 to expose the top surfaces of the first electrode135 a and the second electrode 135 b, and filling the openings with aconductive material. The openings may be formed by an etching processusing a patterned mask as an etching mask, and the conductive materialmay be formed by a deposition process, such as a CVD process or an ALDprocess. Then, a planarization process, such as a CMP process, may beperformed to remove any excess material over the top surface of thesecond dielectric layer 141.

After the formation of the conductive contacts 143, the semiconductordevice 100 is obtained. In the present embodiments, the first liner 125a and the second liner 125 b are made of CuMn, and the first electrode135 a and the second electrode 135 b are made of Cu. The CuMn liners(i.e., the first liner 125 a and the second liner 125 b) may reduce orprevent voids from forming in the first electrode 135 a and the secondelectrode 135 b, thereby reducing the contact resistances and improvingthe electromigration reliabilities of the first electrode 135 a and thesecond electrode 135 b. As a result, the device performance may beimproved. In addition, since the fuse link 125 c, the first liner 125 aand the second liner 125 b can be formed using the same process and thesame material, the process cost can be lowered.

FIGS. 17 to 22 are cross-sectional views illustrating intermediatestages during the formation of the semiconductor device 200, inaccordance with some embodiments. As shown in FIG. 17 , thesemiconductor substrate 201 is provided. The semiconductor substrate 201may be a semiconductor wafer such as a silicon wafer.

Alternatively or additionally, the semiconductor substrate 201 mayinclude elementary semiconductor materials, compound semiconductormaterials, and/or alloy semiconductor materials. Examples of theelementary semiconductor materials may include, but are not limited to,crystal silicon, polycrystalline silicon, amorphous silicon, germanium,and/or diamond. Examples of the compound semiconductor materials mayinclude, but are not limited to, silicon carbide, gallium arsenic,gallium phosphide, indium phosphide, indium arsenide, and/or indiumantimonide. Examples of the alloy semiconductor materials may include,but are not limited to, SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP,and/or GaInAsP.

In some embodiments, the semiconductor substrate 201 includes anepitaxial layer. For example, the semiconductor substrate 201 has anepitaxial layer overlying a bulk semiconductor. In some embodiments, thesemiconductor substrate 201 is a semiconductor-on-insulator substratewhich may include a substrate, a buried oxide layer over the substrate,and a semiconductor layer over the buried oxide layer, such as asilicon-on-insulator (SOI) substrate, a silicon germanium-on-insulator(SGOI) substrate, or a germanium-on-insulator (GOI) substrate.Semiconductor-on-insulator substrates can be fabricated using separationby implantation of oxygen (SIMOX), wafer bonding, and/or otherapplicable methods.

Still referring to FIG. 17 , the isolation structures 203 are formed inthe semiconductor substrate 201 to define the active regions, and theisolation structures 203 are shallow trench isolation (STI) structures,in accordance with some embodiments. In addition, the isolationstructures 203 may be made of silicon oxide, silicon nitride, siliconoxynitride or another applicable dielectric material, and the formationof the isolation structures 203 may include forming a patterned mask(not shown) over the semiconductor substrate 201, etching thesemiconductor substrate 201 to form openings (not shown) by using thepatterned mask as an etching mask, depositing a dielectric material inthe openings and over the semiconductor substrate 201, and planarizingthe dielectric material until the semiconductor substrate 201 isexposed.

Moreover, in some embodiments, the deep well region 205 is formed in theactive regions defined by the isolation structures 203. In someembodiments, the deep well region 205 is formed by one or more ionimplantation processes, and P-type dopants, such as boron (B), gallium(Ga), or indium (In), or N-type dopants, such as phosphorous (P) orarsenic (As), can be implanted in the semiconductor substrate 201 toform the deep well region 205, depending on the conductivity type of thesemiconductor device 200.

Still referring to FIG. 17 , the first dielectric layer 207 is formedover the semiconductor substrate 201 and covering the isolationstructures 203 and the deep well region 205, in accordance with someembodiments. In some embodiments, the first dielectric layer 207 is madeof silicon oxide, silicon nitride, silicon oxynitride, a combinationthereof, or another dielectric material, and is formed by a depositionprocess, such as a CVD process, an ALD process, a PVD process, a spin-oncoating process, or a combination thereof.

Next, the gate structure 213 including the gate dielectric layer 209 andthe gate electrode layer 211 is formed over the first dielectric layer207, and the gate spacers are formed on opposite sidewalls of the gatestructure 213, as shown in FIG. 18 in accordance with some embodiments.The respective step is illustrated as the step S33 in the method 30shown in FIG. 6 . In some embodiments, the gate dielectric layer 209 ismade of silicon oxide, silicon carbide, silicon nitride, siliconoxynitride, a dielectric material with high dielectric constant(high-k), or a combination thereof, and the gate electrode layer 211 ismade of polysilicon, a metal material (e.g., aluminum (Al), copper (Cu),tungsten (W), titanium (Ti), tantalum (Ta)), a metal silicide material,or a combination thereof.

In some embodiments, the formation of the gate structure 213 includessequentially forming a gate dielectric material (not shown) and a gateelectrode material (not shown) over the first dielectric layer 207 bydeposition processes. The deposition process may include CVD, ALD, PVD,sputtering, electroplating, or a combination thereof. Then, an etchingprocess is performed on the gate dielectric material and the gateelectrode material using a patterned mask (not shown) as an etchingmask. The etching process may include a wet etching process, a dryetching process, or a combination thereof. After the gate structure 213is formed, the patterned mask may be removed.

In some embodiments, the gate spacers 215 are made of silicon oxide,silicon carbide, silicon nitride, silicon oxynitride, another applicabledielectric material, or a combination thereof. In some embodiments, theformation of the gate spacers 215 includes conformally depositing aspacer material (not shown) on the top surface and the sidewalls of thegate structure 213 and on the top surface of the first dielectric layer207. The deposition process may include a CVD process, a PVD process, anALD process, a spin-on coating process, or another applicable process.Then, the spacer material is etched by an anisotropic etching process,which removes the same amount of the spacer material vertically in allplaces, leaving the gate spacers 215 on the sidewalls of the gatestructure 213. In some embodiments, the etching process is a dry etchingprocess.

Moreover, the first well region 217 and the second well region 219 areformed in the semiconductor substrate 201 after the gate spacers 215 areformed. In some embodiments, the first well region 217 and the secondwell region 219 are formed in the deep well region 205 and on oppositesides of the gate structure 213. The respective step is illustrated asthe step S35 in the method 30 shown in FIG. 6 . In some embodiments, thefirst well region 217 and the second well region 219 are formed by anion implantation process using the gate structure 213 and the gatespacers 215 as an implanting mask.

Some dopants used to form the first well region 217 and the second wellregion 219 are similar to, or the same as those used to form the deepwell region 205, and details thereof are not repeated herein. In someembodiments, the conductivity type of the dopants in the first wellregion 217 is the same as the conductivity type of the dopants in thesecond well region 219, and the conductivity type of the dopants in thefirst well region 217 is opposite to the conductivity type of thedopants in the deep well region 205. In addition, the implantation doseof the first well region 217 and the second well region 219 may begreater than that of the deep well region 205.

Subsequently, the second dielectric layer 221 is formed over the firstdielectric layer 207 and covering the gate structure 213 and the gatespacers 215, as shown in FIG. 19 in accordance with some embodiments.The respective step is illustrated as the step S37 in the method 30shown in FIG. 6 . The second dielectric layer 221 may include siliconoxide, silicon nitride, silicon oxynitride, a combination thereof, oranother dielectric material, and may be formed by a deposition process,such as a CVD process, an ALD process, a PVD process, a spin-on coatingprocess, or a combination thereof. In some embodiments, the seconddielectric layer 221 and the first dielectric layer 207 are made ofdifferent materials.

Still referring to FIG. 19 , a patterned mask 223 with an opening 230 isformed over the second dielectric layer 221, and an etching process isperformed on the second dielectric layer 221 by using the patterned mask223 as an etching mask, such that the opening 230 is transferred fromthe patterned mask 223 to the second dielectric layer 221, and anopening 240 exposing the first dielectric layer 207 is obtained, inaccordance with some embodiments. In some embodiments, the openings 230and 240 are formed over the first well region 217. In some embodiments,the etching process includes a wet etching process, a dry etchingprocess, or a combination thereof.

After the opening 240 is formed in the second dielectric layer 221, abarrier material 243 and a conductive material 253 is sequentiallyformed in the openings 230 and 240, and over the top surface of thepatterned mask 223, as shown in FIG. 20 in accordance with someembodiments. In some embodiments, the conductive material 253 isseparated from the first dielectric layer 207, the second dielectriclayer 221 and the patterned mask 223 by the barrier material 243.

In some embodiments, the barrier material 243 is made of CuMn, and isformed by a deposition process, such as a CVD process, an ALD process, aPVD process, or a combination thereof. In some embodiments, theconductive material 253 is made of Cu, and is formed by a depositionprocess, such as a CVD process, an ALD process, a PVD process, asputtering process, a plating process, or a combination thereof.

Next, a planarization process, such as a CMP process, is performed onthe patterned mask 223, the barrier material 243 and the conductivematerial 253 to remove any excess material over the top surface of thesecond dielectric layer 221, such that the conductive structure 257including the conductive plug 255 and the barrier layer 245 is obtained,as shown in FIG. 21 in accordance with some embodiments. The respectivestep is illustrated as the step S39 in the method 30 shown in FIG. 6 .

Still referring to FIG. 21 , a patterned mask 263 with an opening 270 isformed over the second dielectric layer 221, and an etching process isperformed on the second dielectric layer 221 by using the patterned mask263 as an etching mask, such that the opening 270 is transferred fromthe patterned mask 263 to the second dielectric layer 221, and anopening 280 exposing the gate structure 213 is obtained, in accordancewith some embodiments. Specifically, a portion of the gate electrodelayer 211 is exposed by the opening 280. In some embodiments, theetching process includes a wet etching process, a dry etching process,or a combination thereof.

After the opening 280 over the gate structure 213 is formed, the gateconductive plug 283 is formed filling the opening 280, as shown in FIG.22 in accordance with some embodiments. The respective step isillustrated as the step S41 in the method 30 shown in FIG. 6 . In someembodiments, the gate conductive plug 283 is made of a conductivematerial, such as tungsten (W), aluminum (Al), titanium (Ti), tantalum(Ta), gold (Au), silver (Ag), copper (Cu), or a combination thereof. Theformation of the gate conductive plug 283 may include a depositionprocess (e.g., CVD, ALD, and PVD) and a subsequent planarization process(e.g., CMP).

Referring back to FIG. 4 , the third dielectric layer 291 is formed overthe second dielectric layer 221, and the conductive layers 293 and 295are formed in the third dielectric layer 291, in accordance with someembodiments. The respective step is illustrated as the step S43 in themethod 30 shown in FIG. 6 . Some materials and processes used to formthe third dielectric layer 291 are similar to, or the same as those usedto form the second dielectric layer 221, and details thereof are notrepeated herein.

In some embodiments, the conductive layer 293 is formed over andelectrically connected to the conductive structure 257, and theconductive layer 295 is formed over and electrically connected to thegate conductive plug 283. In some embodiments, the conductive layers 293and 295 are made of a conductive material, such as tungsten (W),aluminum (Al), titanium (Ti), tantalum (Ta), gold (Au), silver (Ag),copper (Cu), or a combination thereof. The formation of the conductivelayers 293 and 295 may include forming openings (not shown) in the thirddielectric layer 291 using a patterned mask as an etching mask, forminga conductive material in the openings and over the third dielectriclayer 291, and performing a planarization process (e.g., CMP) to removeany excess material over the top surface of the third dielectric layer291.

After the formation of the conductive layers 293 and 295, thesemiconductor device 200 with the anti-fuse structure 300 is obtained.In the present embodiments, the barrier layer 245 is made of CuMn, andthe conductive plug 255 is made of Cu. The CuMn liners (i.e., thebarrier layer 245) may reduce or prevent voids from forming in theconductive plug 255, thereby reducing the contact resistance andimproving the electromigration reliability of the conductive plug 255.As a result, the device performance may be improved.

Embodiments of the semiconductor device 100 and 200 and method forpreparing the same are provided in the disclosure. In some embodiments,the CuMn liners (i.e., the first liner 125 a and the second liner 125 bin the semiconductor device 100, and the barrier layer 245 in thesemiconductor device 200) surrounding the copper conductive structures(i.e., the first electrode 135 a and the second electrode 135 b in thesemiconductor device 100, and the conductive plug 255 in thesemiconductor device 200) may reduce or prevent voids from forming inthe conductive structures, thereby reducing the contact resistances andimproving the electromigration reliabilities of the conductivestructures. As a result, the device performance may be improved.

In one embodiment of the present disclosure, a semiconductor device isprovided. The semiconductor device includes a first electrode and asecond electrode disposed in a first dielectric layer. The semiconductordevice also includes a first liner separating the first electrode fromthe first dielectric layer. The semiconductor device further includes afuse link disposed in the first dielectric layer. The fuse link isdisposed between and electrically connected to the first electrode andthe second electrode, and the fuse link and the first liner are made ofcopper-manganese (CuMn).

In another embodiment of the present disclosure, a semiconductor deviceis provided. The semiconductor device includes a first well region and asecond well region disposed in a semiconductor substrate. Thesemiconductor device also includes a first dielectric layer disposedover the semiconductor substrate and covering the first well region andthe second well region, and a gate structure disposed over the firstdielectric layer and between the first well region and the second wellregion. The semiconductor device further includes a conductive structuredisposed over and separated from the first well region by a portion ofthe first dielectric layer. The conductive feature includes a barrierlayer and a conductive plug disposed over the barrier layer, and thebarrier layer is made of copper-manganese (CuMn). The first well region,the conductive structure and the portion of the first dielectric layerform an anti-fuse structure.

In yet another embodiment of the present disclosure, a method forpreparing a semiconductor device is provided. The method includesforming an opening structure in a first dielectric layer. The openingstructure has a first portion, a second portion and a third portiondisposed between and physically connecting the first portion and thesecond portion. The method also includes forming a lining materiallining the first portion and the second portion of the opening structureand completely filling the third portion of the opening structure. Thelining material is made of copper-manganese (CuMn). The method furtherincludes filling the first portion and the second portion of the openingstructure with a conductive material after the lining material isformed, and performing a planarization process on the lining materialand the conductive material.

The embodiments of the present disclosure have some advantageousfeatures. By forming a CuMn liner surrounding the conductive structure,the formation of voids in the conductive structure may be reduced orprevented, which reduces the contact resistance and improves theelectromigration reliability of the conductive structure. As a result,the device performance may be improved.

Although the present disclosure and its advantages have been describedin detail, it should be understood that various changes, substitutionsand alterations can be made herein without departing from the spirit andscope of the disclosure as defined by the appended claims. For example,many of the processes discussed above can be implemented in differentmethodologies and replaced by other processes, or a combination thereof.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present disclosure. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, and steps.

What is claimed is:
 1. A method for preparing a semiconductor device,comprising: forming an opening structure in a first dielectric layer,wherein the opening structure has a first portion, a second portion anda third portion disposed between and physically connecting the firstportion and the second portion; forming a lining material lining thefirst portion and the second portion of the opening structure andcompletely filling the third portion of the opening structure, whereinthe lining material includes copper-manganese (CuMn); filling the firstportion and the second portion of the opening structure with aconductive material after the lining material is formed; and performinga planarization process on the lining material and the conductivematerial.
 2. The method for preparing a semiconductor device of claim 1,wherein the first portion of the opening structure has a first width,the second portion of the opening structure has a second width, thethird portion of the opening structure has a third width, the firstwidth, the second width and the third width are parallel to each other,and wherein the first width and the second width are both greater thanthe third width.
 3. The method for preparing a semiconductor device ofclaim 1, wherein forming the opening structure in the first dielectriclayer comprises using a patterned mask as an etching mask, and whereinthe planarization process is performed until the patterned mask isexposed.
 4. The method for preparing a semiconductor device of claim 1,wherein the conductive material includes copper (Cu).
 5. The method forpreparing a semiconductor device of claim 1, wherein after theplanarization process is performed, a remaining portion of the liningmaterial in the third portion of the opening structure is configured asa fuse link, a remaining portion of the conductive material in the firstportion of the opening structure is configured as a first electrode, anda remaining portion of the conductive material in the second portion ofthe opening structure is configured as a second electrode, and whereinthe first electrode, the second electrode and the fuse link form a fusestructure.
 6. The method for preparing a semiconductor device of claim5, further comprising: forming a second dielectric layer over the fusestructure; and forming a plurality of conductive contacts penetratingthrough the second dielectric layer, wherein a first set of theplurality of conductive contacts is electrically connected to the firstelectrode, and a second set of the plurality of conductive contacts iselectrically connected to the second electrode.